Removal of undetected coarse particles at the particle count level without clogging, enabling high-speed classification and improved processing capacity.
■ Main Causes of Coarse Particle Contamination - Contamination from coarse particles or agglomerates of the same material from the classification device - Contamination from coarse particles of different materials around the classification device - Contamination from unspecified locations in the manufacturing process by coarse particles and dust ■ Innovative Technology Development 1. Super Micro Sieve 2. Classification Structure Based on Original Principles 3. Know-how for Fine Particle Classification ■ Photo Right: Ultrasonic Tank - This part is equipped with the Super Micro Sieve Photo Left: Desiccator - This part collects the classified particles Ultrasonic Tank: Image analysis of particles before classification using FPIA-3000 Desiccator: Image analysis of particles after classification using FPIA-3000
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Semtech Engineering Co., Ltd. specializes in ultra-fine processing using electroforming technology, as well as the development and contract manufacturing of ultra-high precision sieves and ultra-high precision fine molds. We excel in ultra-high aspect ratio technology that is impossible with etching, so please feel free to contact us with your inquiries.