Rationalization assembly device

Company information

Grant Co., Ltd. main office

Electronic Components and Semiconductors

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Grant Corporation continues to evolve daily as a manufacturer of equipment that meets the needs of the manufacturing site, with the fusion technology of "Engineering × Electronics" at its core. Our mission goes beyond merely creating machines; we aim to provide essential solutions to our customers' challenges with "creativity" and "proposal power." Our strengths lie in the trinity of "technical capability," "responsiveness," and "proposal power." By managing the entire process in-house—from development, design, and manufacturing to startup and after-sales service—we achieve high quality, short delivery times, and high cost performance, delivering solutions that exceed our customers' expectations. With our headquarters in Mie and a branch in Osaka, we can flexibly respond to projects nationwide. Armed with on-site capabilities and a sense of speed, we support productivity and quality improvement across diverse industries (automotive, electronic components, precision machinery, medical, etc.) through the provision of optimal equipment. Moving forward, we will continue to challenge ourselves as a trusted partner, pursuing value creation with a forward-looking perspective and supporting Japanese manufacturing.

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