Introducing an experimental verification on "how much difference substrate patterning makes in thermally demanding circuits!"
An important factor in machine design, circuit design, and substrate design is "controlling heat." The heat dissipation path, from the perspective of thermal resistance, is significantly large, as heat conducted from components to the substrate wiring is transmitted into the air. With the recent trend of high-density integration of components and miniaturization of devices, the importance of measures through substrate patterning has been increasing. Here, we will introduce specific thermal countermeasures based on verification experiments regarding "how much difference substrate patterning can make in thermally demanding circuits." *For detailed content of the article, please refer to the related links. For more information, feel free to contact us.*
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