Established a method for high-precision component evaluation using sensitivity and quantification-focused SIMS (D-SIMS)!
The component evaluation of the wafer bevel area is generally conducted using TEM or TOF-SIMS; however, both of these methods have limitations in sensitivity and quantification, making it difficult to evaluate trace components. By using a newly developed dedicated fixture, we have established a method for high-precision component evaluation using sensitivity- and quantification-focused SIMS (D-SIMS). Please feel free to contact us when needed. 【Technical Overview】 ■ Fixed with a dedicated fixture to prevent positional shifts of samples in an unstable tilted state and to reduce detection stability issues. ■ Measurement positions can be selected with high precision and flexibility. *For more details, please download the PDF or feel free to contact us.
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Our company offers contract analysis services. Since our establishment in August 2002, we have utilized reliable analysis and measurement technologies along with state-of-the-art equipment to provide optimal nano-level microfabrication, analysis, evaluation of reliability, environmental safety chemical analysis, and service solutions for a wide range of markets centered around semiconductors, liquid crystals, metals, and new materials. Please feel free to contact us if you have any requests.
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