Can be used for uniform coating formation on circular substrates! We also have solutions for applying to three-dimensional objects and curved surfaces.
The "Spin Coat" is a product that allows for the control of film thickness distribution from the inner circumference to the outer circumference, achieved through a multi-stage spin program and suitable coating + UV irradiation conditions. With a resin supply and discharge management system and unique spin process control technology, it enables the stable supply and film formation of precise liquid adhesives (single-component/double-component types) on circular and irregular substrates. Additionally, by operating in combination with a vacuum lamination process and autoclave treatment, the formation of precise adhesive layers is also possible. 【Features】 ■ Enables the stable supply and film formation of precise liquid adhesives (single-component/double-component types) on circular and irregular substrates. ■ Provides coating solutions for three-dimensional objects and curved surfaces. ■ Multi-stage spin program and suitable coating + UV irradiation conditions. *For more details, please refer to the related links or feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the related links or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■ Uniform coating formation on circular substrates (such as silicon wafers, glass wafers, and lens substrates) ■ Precision and bubble-free bonding after the above coating formation ■ Formation of adhesive layers and protective films for optical discs (DVD/Blue-ray) *For more details, please refer to the related links or feel free to contact us.
Company information
Our company manufactures and sells power supply equipment, semiconductor devices, precision mechanical components, system equipment, and synthetic resin coatings. Leveraging our strengths through a five-business structure consisting of precision mechanical components, coatings, power supply devices, bonding/coating equipment, and power semiconductors, we engage in "proposal-based product development" that values communication with our customers. Additionally, through consulting and dialogue during the development process, we not only meet the functions requested by our customers but also provide new satisfaction with added value.