Introducing an application that uses ultrasonic bonding to connect flexible substrates with low resistance!
We would like to introduce our "Ultrasonic Direct Bonding Technology for Substrates." In comparison with our TEG substrates, the connection resistance achieved through ultrasonic bonding is 14mΩ, which is a 70% reduction compared to ACF connections at 52mΩ. This contributes to the high performance of electronic devices, such as high-speed data transfer. Additionally, the bonding time with ultrasonic bonding is approximately 0.2 to 1 second, allowing for a significant reduction in time compared to ACF connections that require resin melting and curing. 【Features】 ■ Low resistance bonding: 70% reduction compared to ACF ■ Short bonding time: bonding in under 1 second ■ Room temperature bonding: no bonding misalignment due to thermal expansion of the substrate *For more details, please download the PDF or feel free to contact us.
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In addition to our unique technologies such as ultrasonic application technology, we contribute to our customers' technological innovations as a device manufacturer in the following business areas, including research and development and mass production processes, by flexibly responding to customer needs. Our devices are designed with the premise of freely controlling processes using cutting-edge device technology and process technology, serving as tools to realize ideas and assist in our customers' product innovations. ■ Core Technologies - Ultrasonic application technology (expanding applications in the fields of bonding, cutting, and welding) - Actuator technology (achieving simultaneous control of position and load with our unique air pressurization technology) - Device technology (providing functions that satisfy customer needs in the form of devices) ■ Business Areas Developing, manufacturing, and selling product manufacturing equipment in the following fields: - Secondary battery field - Electronics field - Automotive field - High-performance materials field - Carbon fiber reinforced resin field
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