Directly forming heat dissipation fins (pin fins/ribbon fins) on the back of the substrate achieves a high thermal conductivity (approximately 34 times that of TIM and about 7 times that of solder).
The Adwells ultrasonic pin bonding device PB2000MS and ribbon bonder RB0300SS can directly form heat dissipation pins and substrate mounting pins on ceramic substrates and organic substrates. With ultrasonic bonding, it is possible to form heat sinks without using TIM or solder, achieving a thermal conductivity approximately 34 times that of TIM and about 7 times that of solder. (Figure 1) The formation of heat sinks through ultrasonic bonding comes in two types: pin bonding and ribbon bonding. In pin bonding, simultaneous bonding of up to 4 pins can be achieved at once, allowing for programmable heat sink formation. (Photo 1) In ribbon bonding, Cu ribbons or Al ribbons are continuously bonded to form heat sinks. The device is equipped with a multi-feeder, allowing for automatic switching of ribbon materials and thicknesses. (Photo 2) ~ For more details, please download the PDF document and check it out ~ *) We also accept evaluation tests using demo machines, so if you are interested, please contact us using the form below.
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The formation of heat sinks through ultrasonic bonding comes in two types: pin bonding and ribbon bonding. In pin bonding, simultaneous bonding of up to 4 pins can be achieved at once, allowing for programmable formation of heat sinks. (Photo 1)
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In ribbon bonding, Cu ribbons and Al ribbons are continuously joined to form a heat sink. The device is equipped with a multi-feeder, allowing for automatic switching of the ribbon material and thickness. (Photo 2)
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In addition to our unique technologies such as ultrasonic application technology, we contribute to our customers' technological innovations as a device manufacturer in the following business areas, including research and development and mass production processes, by flexibly responding to customer needs. Our devices are designed with the premise of freely controlling processes using cutting-edge device technology and process technology, serving as tools to realize ideas and assist in our customers' product innovations. ■ Core Technologies - Ultrasonic application technology (expanding applications in the fields of bonding, cutting, and welding) - Actuator technology (achieving simultaneous control of position and load with our unique air pressurization technology) - Device technology (providing functions that satisfy customer needs in the form of devices) ■ Business Areas Developing, manufacturing, and selling product manufacturing equipment in the following fields: - Secondary battery field - Electronics field - Automotive field - High-performance materials field - Carbon fiber reinforced resin field
