Highly versatile software! Reliable hardware is also a notable feature.
The "RV Series" is a smart board appearance inspection machine that combines inspection and measurement functions. The high-speed 3D compatible models "RV-2-3DHL" and "RV-2-3DH" utilize a 12-megapixel high-resolution camera, which expands the camera's field of view by 192% compared to previous models. Additionally, the template mode, which is easy and quick to use while achieving high inspection performance, allows users to select the inspection component type using pre-prepared templates, automatically detecting shapes and leads and generating packages. 【Lineup】 ■RV-2-3DHL ■RV-2-3DH ■RV-2 *For more details, please download the PDF or feel free to contact us.
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【Common Specifications】 ■ Power Supply: AC three-phase 200–230V ■ Apparent Power: 2.0kVA or less ■ Operating Air Pressure: 0.5MPa ■ Air Consumption (Standard Conditions): 10L/min *For more details, please download the PDF or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."