New! Laser Circuit Board Processing Machine LPKF ProtoLaser H4

basic information

■Maximum substrate and processing size (X/Y/Z): 310 mm x 230 mm x 8 mm ■Laser: 1064nm, 25~400 kHz, 20W ■Maximum spindle rotation speed: 100,000 RPM ■Tool exchange: Automatic exchange, 14 tools ■Minimum line/space: 100 µm/30 µm (depending on the substrate) ■Laser processing speed: 14 cm²/min (depending on the substrate) ■Device dimensions (W x H x D): 725 mm x 665 mm x 840 mm ■Weight: 125 kg (granite base) ■Power supply: 115 – 230 V, 50 – 60 Hz, 500 W *For more details, please refer to the catalog or feel free to contact us.

Price range

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Applications/Examples of results

This is a laser system for prototype processing of printed circuit boards. It performs surface pattern processing with an IR fiber laser. Additionally, it is a hybrid system capable of drilling and contour cutting with a drill motor that operates at 100,000 RPM. The LPKF ProtoLaser H4 is a very compact tabletop laser PCB processing machine that can process materials ranging from FR4 to delicate RF boards, making it suitable for various applications.

Detailed information

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  Desktop laser printed circuit board processing machine

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  LPKF ProtoLaser sample

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  Laser-assisted resist removal

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