Direct testing on specific chips and boards is possible from -75℃ to +200℃.
It is possible to simulate a wide range of temperature conditions and conduct durability and performance tests of components on substrates under extreme temperature conditions. Not only temperature tests, but also through a piston connected to a dry air pressure source, it is possible to ensure proper electronic contact of the device and confirm the establishment of effective thermal contact. For detailed specifications, please refer to the brochure.
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Please refer to the brochure for detailed specifications.
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Integrated circuit (IC) manufacturers such as Intel, NVIDIA, Broadcom, Qualcomm, research and development institutions, and various companies engaged in quality control and failure analysis.
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