Save space inside the product! Lightweight, compact, and diverse designs are possible.
We would like to introduce the potential of our "3D MID." Moving away from the conventional mindset of assembling wired components in a flat (2D) format to create a three-dimensional (3D) structure, we are now wiring directly onto the 3D object itself, leading to a new design methodology. Additionally, we can achieve high dimensional accuracy and 3D sensing capabilities, enabling innovative applications such as autonomous driving and AR through the proper arrangement of optical sensors and the integration of multiple functions. 【Features】 ■ Lightweight and compact ■ No assembly required ■ High dimensional accuracy ■ 3D sensing capability *For more details, please download the PDF or feel free to contact us.
Inquire About This Product
basic information
For more details, please download the PDF or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please download the PDF or feel free to contact us.
catalog（2）
Download All Catalogs
Company information
Our company is a total solution provider for three-dimensional MID products, contributing to a society that seeks to enhance design freedom for our customers while promoting high efficiency and resource conservation. We propose opportunities for our customers to create new ideas and concepts during the upstream design phase, and by realizing these with our three-dimensional MID products, we provide new services and value. Additionally, our three-dimensional MID features high-precision processing, ultra-fine three-dimensional wiring, and high mounting accuracy in three-dimensional mounting technology, which can help reduce unmeasurable risks in various scenarios, such as with edge sensors.
![Understand in 3 minutes! A substrate that dissipates heat faster [Materials available].](https://image.mono.ipros.com/public/product/image/1ab/2001482620/IPROS9539451614471571514.jpg?w=280&h=280)
