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  3. センインテクノロジーズ
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Electronic Components and Semiconductors
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センインテクノロジーズ

addressTokyo/Chuo-ku/2F,Nihonbashi Life Science Bldg.8,1-3-15 Nihonbashi Horidome-cho
phone03-5843-6749
last updated:Nov 17, 2025
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Benefits of Senin Technologies

It is possible to miniaturize and simplify the internal structure of devices with complex components such as PCB substrates, flexibles, and harnesses!

Our company offers a high-adhesion plating suitable for electronic component mounting and a high-precision three-dimensional MID service. We propose three-dimensional MID products with high dimensional accuracy using materials and methods that meet customer needs, without being limited to specific molding materials, through fine wiring. Additionally, we can provide rapid and consistent support from design, manufacturing, three-dimensional component mounting, sales, to the implementation of three-dimensional MID products. 【Features】 - Proposing three-dimensional MID products with high dimensional accuracy using materials and methods that meet customer needs. - Providing rapid and consistent support from design, manufacturing, three-dimensional component mounting, sales, to the implementation of three-dimensional MID products. - Capable of proposing from design ideas. *For more details, please download the PDF or feel free to contact us.

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Comparison of 3D MID Construction Methods

Explaining selection points by application! Both the one-shot method and the two-shot method have proven production results.

We will introduce a comparison of three-dimensional MID construction methods. The one-shot method involves forming circuits through laser processing and etching after resin molding, using a general-purpose resin as the molding material. The two-shot method involves molding a substrate in the first shot and forming circuits by masking in the second shot. The molding material for the first shot is a general-purpose resin, while the second shot uses biodegradable resin. 【One-shot method process】 ■ Injection molding ■ Laser processing ■ Partial etching ■ Plating treatment *For more details, please download the PDF or feel free to contact us.

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The possibilities of three-dimensional MID.

Save space inside the product! Lightweight, compact, and diverse designs are possible.

We would like to introduce the potential of our "3D MID." Moving away from the conventional mindset of assembling wired components in a flat (2D) format to create a three-dimensional (3D) structure, we are now wiring directly onto the 3D object itself, leading to a new design methodology. Additionally, we can achieve high dimensional accuracy and 3D sensing capabilities, enabling innovative applications such as autonomous driving and AR through the proper arrangement of optical sensors and the integration of multiple functions. 【Features】 ■ Lightweight and compact ■ No assembly required ■ High dimensional accuracy ■ 3D sensing capability *For more details, please download the PDF or feel free to contact us.

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Business activities

One-stop support! Providing customers with "things that seem like they should exist but don't" in the world.

We would like to introduce the business activities we are engaged in. As a total solution provider for three-dimensional MID, we utilize three-dimensional wiring technology to offer our customers one-stop support from design consulting to design development and manufacturing, providing them with "things that seem like they should exist" but don't. Additionally, we can accommodate concepts for three-dimensional MID even at the sketch level. Please feel free to consult us regarding three-dimensional MID, regardless of whether implementation is involved. 【Services Offered】 ■ Consulting related to three-dimensional MID ■ Design ■ Specification design and manufacturing ■ Plating processing ■ Three-dimensional implementation *For more details, please download the PDF or feel free to contact us.

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What is 3D MID?

Fine three-dimensional wiring can be achieved in complex injection-molded products! Efforts are also being made to reduce the weight, size, and complexity of the equipment.

We would like to introduce our "Three-Dimensional MID." MID refers to products that have wiring applied to injection-molded items, and products with three-dimensional wiring are called three-dimensional MID. Additionally, there are representative methods such as the one-shot method and the two-shot method, and we have mass production experience with both in Japan. 【Features】 ■ Fine three-dimensional wiring can be achieved on complex injection-molded products. ■ By implementing three-dimensional components, it is possible to achieve functional integration. ■ It allows for the lightweight, compact, and integrated design of devices. ■ We also provide implementation services for the three-dimensional MID products themselves, such as circuit boards. *For more details, please download the PDF or feel free to contact us.

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