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  6. Comparison of 3D MID Construction Methods

Comparison of 3D MID Construction Methods

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last updated:Aug 29, 2025

センインテクノロジーズ
センインテクノロジーズ

Explaining selection points by application! Both the one-shot method and the two-shot method have proven production results.

We will introduce a comparison of three-dimensional MID construction methods. The one-shot method involves forming circuits through laser processing and etching after resin molding, using a general-purpose resin as the molding material. The two-shot method involves molding a substrate in the first shot and forming circuits by masking in the second shot. The molding material for the first shot is a general-purpose resin, while the second shot uses biodegradable resin. 【One-shot method process】 ■ Injection molding ■ Laser processing ■ Partial etching ■ Plating treatment *For more details, please download the PDF or feel free to contact us.

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スクリーンショット

Comparison of 3D MID Construction Methods

スクリーンショット 2025-08-29 1057571.png
スクリーンショット 2025-08-29 1057571.png
  • Related Link - https://senintech.com/

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【Process of the Two-Shot Method】 ■ Primary Molding ■ Etching ■ Secondary Molding ■ Catalyst Treatment / Dissolution of Secondary Molding ■ Plating Treatment *For more details, please download the PDF or feel free to contact us.

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Senin Technologies Co., Ltd. Company and Technology Introduction

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Senin Technologies Co., Ltd. Company Profile

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センインテクノロジーズ

センインテクノロジーズ

Electronic Components and Semiconductors

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Our company is a total solution provider for three-dimensional MID products, contributing to a society that seeks to enhance design freedom for our customers while promoting high efficiency and resource conservation. We propose opportunities for our customers to create new ideas and concepts during the upstream design phase, and by realizing these with our three-dimensional MID products, we provide new services and value. Additionally, our three-dimensional MID features high-precision processing, ultra-fine three-dimensional wiring, and high mounting accuracy in three-dimensional mounting technology, which can help reduce unmeasurable risks in various scenarios, such as with edge sensors.

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