It is possible to miniaturize and simplify the internal structure of devices with complex components such as PCB substrates, flexibles, and harnesses!
Our company offers a high-adhesion plating suitable for electronic component mounting and a high-precision three-dimensional MID service. We propose three-dimensional MID products with high dimensional accuracy using materials and methods that meet customer needs, without being limited to specific molding materials, through fine wiring. Additionally, we can provide rapid and consistent support from design, manufacturing, three-dimensional component mounting, sales, to the implementation of three-dimensional MID products. 【Features】 - Proposing three-dimensional MID products with high dimensional accuracy using materials and methods that meet customer needs. - Providing rapid and consistent support from design, manufacturing, three-dimensional component mounting, sales, to the implementation of three-dimensional MID products. - Capable of proposing from design ideas. *For more details, please download the PDF or feel free to contact us.
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Our company is a total solution provider for three-dimensional MID products, contributing to a society that seeks to enhance design freedom for our customers while promoting high efficiency and resource conservation. We propose opportunities for our customers to create new ideas and concepts during the upstream design phase, and by realizing these with our three-dimensional MID products, we provide new services and value. Additionally, our three-dimensional MID features high-precision processing, ultra-fine three-dimensional wiring, and high mounting accuracy in three-dimensional mounting technology, which can help reduce unmeasurable risks in various scenarios, such as with edge sensors.