The number of processing chambers is 1 to 4! The wafer materials are SiC, Si, GaAs, GaN, glass, and LT substrates.
We would like to introduce a case study of our "Precision Cleaning Equipment." This equipment is used for cleaning precision components such as semiconductor wafers and hard disks, employing a batch format to remove contamination from particles, chemicals, and metals. Since it cleans wafers one by one, it is suitable for small-batch production of various types and high-functionality cleaning. 【Product Specifications】 ■ Semiconductor wafers (SiC, GaN, silicon, sapphire, etc.), MEMS ■ Wafer materials: SiC, Si, GaAs, GaN, glass, LT substrates ■ Wafer sizes: 2 to 12 inches ■ Number of processing chambers: 1 to 4 ■ Chemicals: Up to 2 types (optional: 3 types) *For more details, please download the PDF or feel free to contact us.
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Shinano Seiki has been developing its business under the management philosophy of "pursuing customer satisfaction and technological capability to the utmost and contributing to society." Each member of the group, based on this management philosophy, is uniting their efforts with high technology, a desire for improvement, and a professional mindset to contribute to customer satisfaction and the development of society. Furthermore, with the motto "cutting-edge technology is born from the field," we are adopting a field-oriented approach as our guiding principle and are making daily efforts.