The selective soldering machine has undergone a model change! Managing the device, which has been cumbersome until now, can be done easily.
The "DS-11S" is a dip tester that enables batch measurement of the information necessary for managing selective soldering equipment by using a dedicated program. Without the need for a PC, all results can be checked on the display of the main unit. It can accommodate up to five nozzles, even in devices with multiple nozzles, and individually assesses the condition of each nozzle. Please feel free to contact us when needed. 【Features】 ■ Automatically determines preheat and solder temperature, XY speed, and XY nozzle solder dimensions ■ Allows for pass/fail judgment and management of measurement results using dedicated software ■ Can individually assess the condition of up to five nozzles, even in devices with multiple nozzles ■ All results can be checked on the main unit's display without using a PC *For more details, please download the PDF or feel free to contact us.
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【Measurement Specifications (Partial)】 ■ Preheat Temperature ・Measurement Range: 0 to 330℃ ・Accuracy: ±1℃ ■ Solder Temperature ・Measurement Range: 0 to 330℃ ・Accuracy: ±1℃ ■ XY Speed ・Measurement Range: 0 to 20mm/sec ■ Dip Time ・Measurement Range: 0 to 10 seconds ・Accuracy: ±0.2 seconds *For more details, please download the PDF or feel free to contact us.
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【Purpose】 ■Management of selective soldering equipment *For more details, please download the PDF or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."