RBSiC and 3D printing are fused together. Achieving high-precision and highly reliable semiconductor-related components in the fields of heat treatment and measurement.
"IntrinSiC (R)" leverages the excellent properties of reaction-bonded SiC (RBSiC) to enable the production of complex and high-precision structures through 3D printing. It is optimal for thermal processing in semiconductor manufacturing equipment and precision measurement components, achieving design freedom and shorter delivery times that surpass conventional methods. 【Features】 ■ Stable properties that withstand high-temperature environments ■ Integrated fabrication of large and complex structures ■ Improved smoothness through polishing and lapping finishes ■ Quality assurance and redesign through measurement technology *For more details, please refer to the product catalog available for download as a PDF. *Feel free to contact us with any inquiries.
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*For more details, please refer to the product catalog available for download as a PDF. *Feel free to contact us with any inquiries.
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For more details, please refer to the product catalog available for download as a PDF. Feel free to contact us with any inquiries.
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Our company focuses on the development, manufacturing, and application of carbon and ceramics solutions, combining advanced technology and expertise with high-level customer service to provide products and services. Whether in mass production or highly specialized niche markets, we offer all the technical possibilities of an international company and realize ideas that meet our customers' needs. The group includes the environmental testing division Weiss Technik and the ultrasonic welding division Sono Systems, operating in 10 departments in the fields of materials engineering and mechanical engineering.
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