A structure that minimizes displacement of contact points during compression! The gold flash enhances the wettability of the solder.
We would like to introduce the SM contact "SM-C141514TGCS" that we handle. It features a structure that prevents unexpected spring breakage and provides adequate rebound force from low compression. The contact point position is less likely to shift during compression, and the adsorption point is centered in the product. Additionally, due to its compact size (can be compressed from 0.9mm to 1.2mm), it can be used in mobile phones and small gaming devices. 【Features】 ■ Structure that prevents unexpected spring breakage ■ Adequate rebound force from low compression ■ Structure that minimizes shifting of the contact point position during compression ■ Structure with the adsorption point at the center of the product ■ Compact size (can be compressed from 0.9mm to 1.2mm) ■ High solder wettability due to gold flash, enabling stable conductivity at the contact point *For more details, please download the PDF or feel free to contact us.
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【Specifications】 ■Material: Titanium Copper t=0.08mm ■Recommended Elastic Usage Range: 0.9mm to 1.2mm *For more details, please download the PDF or feel free to contact us.
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Takeuchi Industries pursues high performance and high quality in the electronics field, responding to a wide range of customer needs. We also accommodate special products, so please feel free to contact us.