No need for heat sinks or cooling fans! | Low heat generation CoaXPress camera
With Japan Bopixel's "CoaXPress camera," it is possible to significantly reduce heat generation!
In cameras with significant heat generation, heat dissipation items such as heat sinks, cooling fans, or external Peltier cooling devices may be necessary. By suppressing heat generation, these additional cooling mechanisms can be eliminated, leading to overall cost reduction, space savings, and reduced maintenance efforts for the entire system. Achieving fanless operation (without cooling fans) reduces sources of vibration and dust, making it more suitable for environments such as clean rooms. At Japan Bopixel, we have successfully utilized "Ultra Low Power FPGA," which can reduce power consumption by over 50% compared to FPGAs commonly adopted by the majority of camera manufacturers, as the primary heat source in industrial cameras. By fundamentally suppressing heat generation, we can significantly reduce power consumption and heat generation as a camera, solving thermal issues with a new approach that leverages the advantages of being a latecomer in the market. *For more details, please download the catalog or feel free to contact us.*
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basic information
■Area Scan Cameras 【29×29mm 1Lane Model】0.5M/2M/5.1M/8.1M/12.4M/16.2M/20.4M/24.6M/UV(8.1M) 【40×40mm 1Lane Model】3.2M/5M/8.9M/12M 【60×60mm 4Lane Model】16.2M/20.4M/24.6M 【25M CXP-12×4Lane Model】mono/color/NIR 【65M CXP-6/-12×4Lane Model】mono/color ■Line Scan Cameras 【2k CXP-10x1Lane Model】mono/color 【8k CXP-12x4Lane Model】mono/color 【9k CXP-12x4Lane Model】mono TDI line scan 【16k CXP-12x4Lane Model】mono
Price range
Delivery Time
Applications/Examples of results
Semiconductor front-end/back-end visual inspection, final visual inspection of semiconductor components, visual inspection of assembled boards, various alignments, and industrial image processing focused on semiconductors and electronics.
Detailed information
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[29×29mm 1Lane model] 0.5M/2M/5.1M/8.1M/12.4M/16.2M/20.4M/24.6M
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[40×40mm 1Lane model] 3.2M/5M/8.9M/12M
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[60×60mm 4Lane model] 16.2M/20.4M/24.6M
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[25M CXP12×4Lane model] mono/color
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[65M CXP-6/-12×4Lane model] mono/color
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[8k CXP-12x4Lane model] mono/color
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[9k CXP-12x4Lane model] mono TDI line scan
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Company information
We focus on the design, development, manufacturing, and sales of high-speed, high-resolution, and highly reliable machine vision cameras primarily using CoaXPress and CameraLink. In addition to developing standard products, we also offer development and customization tailored to customer requests. All camera design and development is carried out by our Japanese staff, ensuring design and production techniques that guarantee delicate and highly reliable standards in Japan, while integrating the dynamic action and speed of China to provide competitive products. At Japan Bopixel, we have successfully become the first camera manufacturer to utilize Ultra Low Power FPGA instead of the standard FPGA adopted by the majority of camera manufacturers. This Ultra Low Power FPGA reduces power consumption by over 50% compared to similar class FPGAs, significantly lowering power consumption and heat generation in cameras by addressing the heat source at its root. By actively adopting these next-generation key devices, we are taking a new approach to the heat generation issues that have traditionally been a challenge.
