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  6. Ultra-flat glass with thickness variation of 1μm or less to reduce manufacturing defects in FOWLP.

Ultra-flat glass with thickness variation of 1μm or less to reduce manufacturing defects in FOWLP.

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last updated:Nov 28, 2025

ミツル光学研究所
ミツル光学研究所
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We solve issues such as "thickness variation (TTV)" and "warping" that cannot be addressed by standard glass tolerances.

■Do you have any of these concerns? Are you facing challenges like the following in advanced process development such as FOWLP and PLP? - The TTV (thickness variation) of the glass carrier (support substrate) is large, making it difficult to achieve focus (DOF) in the exposure equipment. - Fine undulations and warping of the substrate cause wafer breakage during debonding. - The supplier's tolerances are loose, leading to frequent specification failures during acceptance inspection. Mitsuru Optical Laboratory's "Ultra-High Precision Glass Carrier" solves these issues. 【Feature 1】Guarantees TTV of less than 1μm. Achieves exposure margin with "ultra-flat processing." 【Feature 2】Controls warping and surface roughness to optimize the debonding process. 【Feature 3】"Full data guarantee system" using AFM and interferometry. *For more details, please download the PDF or feel free to contact us.

    Glass
画像_ミツル光学研究所.png

Ultra-flat glass with thickness variation of 1μm or less to reduce manufacturing defects in FOWLP.

画像_ミツル光学研究所.png
画像_ミツル光学研究所.png
  • Related Link - https://www.mitsuru-op.co.jp/

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basic information

Surface flatness (TTV): Below 1μm (customizable) Surface roughness (Ra): Sub-nanometer order (0.x nm) Supported sizes: φ2 inches to φ12 inches, various rectangular panels Inspection data: AFM, interferometer data available for submission

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Applications/Examples of results

Main application examples: - Glass carriers for FOWLP (Fan-Out Wafer Level Packaging) - Large glass substrates for PLP (Panel Level Packaging) - Interposers for 2.xD / 3D packaging - Support substrates for fine circuit formation

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ミツル光学研究所

ミツル光学研究所

Glass and clay products

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Mitsuru Optical Research Institute has gained a high reputation in the fields of optical glass processing and LCD glass substrate processing, leveraging cutting-edge technology and equipment. In recent years, we have seen an increase in requests for support glass for the wafer thinning process in the semiconductor industry, which demands strict TTV, by applying our cultivated processing technology. Additionally, by utilizing scrap materials from LCD processing, we are pleased to provide verification glass used in various fields at a low cost, not just value-added glass. We would be grateful if you could consult with us at least once.

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