ミツル光学研究所 Product Lineup

We manufacture dummy wafers that can be used for transport tests and condition setting in the development of power semiconductors such as SiC and GaN. We also have extensive experience in processing difficult-to-cut materials (SiC, sapphire, ceramics, etc.). ▼ Do you have any of these concerns? In the process development of next-generation power semiconductors, do you face the following challenges? - You need dummy wafers that comply with **SEMI standards (V-notch with orifice)** for testing, but cannot produce them in small lots. - You want to create the same shape using heat-resistant quartz or glass as an alternative to expensive SiC substrates. - You require special thickness or recessed processing tailored to your equipment, but there are no vendors that can accommodate this. Mitsuru Optical Laboratory's "prototype support capabilities" and "difficult material processing technology" will solve these challenges. 【Feature 1】Supports processing of "difficult-to-cut materials" from quartz to SiC and sapphire. 【Feature 2】Fusion of shape processing compliant with SEMI standards and "special processing." 【Feature 3】"We will turn your requests into reality." Quick response from a single prototype.

• Other semiconductors

■Do you have any of these concerns? Are you facing challenges like the following in advanced process development such as FOWLP and PLP? - The TTV (thickness variation) of the glass carrier (support substrate) is large, making it difficult to achieve focus (DOF) in the exposure equipment. - Fine undulations and warping of the substrate cause wafer breakage during debonding. - The supplier's tolerances are loose, leading to frequent specification failures during acceptance inspection. Mitsuru Optical Laboratory's "Ultra-High Precision Glass Carrier" solves these issues. 【Feature 1】Guarantees TTV of less than 1μm. Achieves exposure margin with "ultra-flat processing." 【Feature 2】Controls warping and surface roughness to optimize the debonding process. 【Feature 3】"Full data guarantee system" using AFM and interferometry. *For more details, please download the PDF or feel free to contact us.

• Glass

At Mitsuru Optical Research Institute Co., Ltd., we provide "LCD glass substrate processing" tailored to our customers' needs. We cut, chamfer, and polish materials sourced from various glass manufacturers according to customer specifications, and we transport them to designated locations nationwide in the specified packaging format. For chamfering, we also accommodate R corner cuts and R chamfer shapes to enhance glass strength. 【Features】 ■ Capable of handling sizes up to 1500×1500 for cutting only ■ Supports cutting of color filters and pre-coated substrates ■ Capable of re-chamfering and resizing glass using large NC machines ■ Conducts sampling inspections based on shipping lot numbers at the time of final shipment ■ Equipped with measurement instruments such as optical microscopes and SEM-EDX *For more details, please refer to our catalog or feel free to contact us.

• Circuit board processing machine
• Other processing machines

At Mitsuru Optical Research Institute Co., Ltd., we provide "optical glass processing" tailored to our customers' needs. We cut, bevel, and polish materials sourced from various glass manufacturers according to your specifications, and we transport them to your designated location nationwide in the requested packaging format. In the optical field, where products come in various thicknesses, the thickness tolerances also vary. We machine materials from a certain base material to create products that meet our customers' needs. 【Features】 ■ Cleaning using ultrasonic cleaning machines ■ Polishing processes tailored to requirements such as surface roughness, parallelism, flatness, precision, and thickness ■ Inspection using interferometers with analytical devices, optical microscopes, etc. *For more details, please refer to our catalog or feel free to contact us.

• Other processing machines

At Mitsuru Optical Research Institute Co., Ltd., we perform "ITO film surface polishing" and "final polishing," among other glass "special processing." "ITO film surface polishing" is done at the Å level to uniform the roughness of the film surface for applications such as organic EL. Additionally, we offer "special shape processing" that allows for irregular shapes seen in smartphones, and "large substrate grinding" that thins glass substrates in a short time using large special processing machines. 【Features】 ≪Final Polishing≫ ■ Removes even ultra-fine defects ■ Creates a smooth surface that appears flawless ≪LCD Panel Polishing≫ ■ Polishes and regenerates NG substrates with scratches caused during etching ■ Strengthens products by preventing cracks from the cutting surface through outer edge chamfering *For more details, please refer to our catalog or feel free to contact us.

• Other processing machines

At Mitsuru Optical Research Institute, we handle "test glass" that can be used as test pieces for evaluating materials such as resists, adhesives, films, and chemical solutions. We can create glass of the same material used in liquid crystal displays in the desired sizes. We offer high-quality glass utilizing the processing technology developed in the manufacturing of liquid crystal displays and optical components. 【Specifications】 ■ Glass Size ・730×920mm to 10×10mm ・Circular: φ450mm to φ10mm ■ Thickness: 0.3t, 0.4t, 0.5t, 0.7t, 1.1t, etc. ■ Outer dimension tolerance: ±0.2mm ■ Edge shape: C-edge, R-edge *For more details, please refer to the catalog or feel free to contact us.

• Glass
• Processing Contract

Mitsuru Optical Research Institute offers "glass wafers" compatible with TTV up to 1μm. These are ideal for applications such as interposers, back-grinding processing supports, and sensor formation substrates. We accommodate various glass materials, including quartz, soda-lime glass, and low-alkali glass. 【Specifications】 ■ Compatible sizes: 2 inch, 4 inch, 6 inch, 8 inch, 12 inch, maximum φ500 ■ Wafer thickness: 0.3mm to 15mm ■ TTV (Total Thickness Variation) ・Thickness variation across the entire wafer: within 0.5μm ■ Edge finishing: chamfering, rounding, and mirror finishing are also possible *For more details, please feel free to contact us.

• Glass
• Processing Contract