A thin film circuit board that achieves weight reduction. High-precision fine circuit pattern formation.
In the aerospace industry, reducing the weight of aircraft is a crucial challenge for improving fuel efficiency and flight performance. Thin-film circuit boards contribute to weight reduction compared to conventional boards, enhancing the performance of aircraft. Our thin-film circuit boards meet the lightweight needs in the aerospace field through high-precision fine circuit pattern formation technology for thin-film electrodes, resistive films, and solder films on ceramic substrates and others. 【Application Scenarios】 - Aircraft, artificial satellites, space exploration vehicles - Radar systems, communication systems - Various sensors 【Benefits of Implementation】 - Improved fuel efficiency due to weight reduction - Enhanced aircraft performance - Reliable circuit design
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【Features】 - High-precision fine circuit pattern formation for thin film electrodes, resistive films, solder films, etc., on ceramic substrates and others - Support for patterning on three-dimensional surfaces - Thick film Cu plating support - Compatibility with various substrate materials such as AlN, AlN/Cu, and SiC - Applications for laser diode (LD) mounting substrates, light-emitting diode (LED) mounting substrates, and photodiode (PD) mounting substrates 【Our Strengths】 Citizen Fine Devices leverages the technology cultivated over many years in the field of functional components that require compact precision, high accuracy, and high detail to provide high-value-added microdevice products. Based on the metal processing technology developed through watch manufacturing, we have established a consistent production line from process design to machining, assembly, and functional testing. By integrating mass production technology for brittle materials, material technology, ultra-precision machining technology, thin film technology, and bonding technology, we deliver high-quality functional device products.
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The area where Citizen Fine Devices demonstrates its strength is in the realm of functional components that require small size, precision, high accuracy, and high detail. We believe that our mission is to continue providing high-value-added microdevice products by leveraging the unique technologies we have developed over many years. Utilizing metal processing technology rooted in watch manufacturing, we have consistently supplied small, high-precision components to our customers for many years through a fully integrated production line that encompasses process design, machining, assembly, and functional testing, along with the unique development of our own processing machines. Additionally, mass-producing components with high precision and efficiency using brittle materials is also one of our core technologies. By integrating material technology with ultra-precision machining, thin-film technology, and bonding technology, we produce not only high-precision components such as ceramics and quartz but also high-quality functional device products like liquid crystal devices and sensing devices. Continuing to provide high-value-added products to the market is a significant dream for our employees. We will contribute to the creation of new value through manufacturing driven by the challenge spirit of each individual, working towards the realization of that dream.






![[Circuit Board Manufacturing Example] Thin Film Circuit Board](https://image.mono.ipros.com/public/product/image/7b4/2000570851/IPROS60687999797142408463.png?w=280&h=280)




