Improving clogging with an ultrasonic powder sieve for ink.
Artec ultrasonic sieve DGS 35kHz, ultrasonic hopper FS 35kHz (Flowsonic)
Improving ink manufacturing by reducing clogging, adhesion, and agglomeration! Achieving higher yields and shorter processing times!
In the ink industry, clogging of powders in the manufacturing process is a significant challenge that leads to decreased production efficiency and variations in quality. Particularly in ink manufacturing that uses fine powders, clogging during the sieving process is an unavoidable issue. Our ultrasonic powder sieving machine has been developed to solve this problem. 【Usage Scenarios】 * Powder sieving in the ink manufacturing process * Classification of powders that are prone to clogging * When it is necessary to prevent foreign matter contamination 【Benefits of Implementation】 * Reduction of production downtime due to clogging * Increased yield through improved sieving efficiency * Stabilization of product quality
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basic information
**Features** * Achieves dry sieving in high mesh with an opening of 20μm * Quick attachment compatible with standard JIS mesh frames from Φ75 to Φ400 using clamp-type fixtures * Measures against surface adhesion, bridging, rat holes, and improved discharge capacity with an ultrasonic hopper * Removal of foreign substances and crushing through ultrasonic sieving at the hopper discharge * Quantitative supply transport with ultrasonic vibration enables management linked with electronic scales **Our Strengths** UC Technology has been a leader in ultrasonic technology since 1966. Based on the trust and achievements cultivated through OEM supply to semiconductor manufacturing equipment, we provide optimal ultrasonic solutions to solve our customers' challenges. We support our customers with a wide range of services, including experimental support, demo machine loans, and consulting.
Price information
The evaluation of the demo unit is usually provided free of charge for two days. If you need to evaluate the demo unit for more than a week, please consult with us. Also, feel free to contact us for a quote on the complete set of ultrasonic units.
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Applications/Examples of results
【Purpose】The ultrasonic vibrating sieve, which can be easily attached to areas troubled by powder adhesion, is effective for mesh clogging caused by powder adhesion and handling measures in powder transport environments. It has been adopted in various raw material developments to mass production environments, including: ■ Paints ■ Battery materials ■ Metal materials ■ Resin materials ■ Pharmaceutical materials/Food materials ■ Toner ■ Chemical products and more *For more details, please refer to the PDF document or feel free to contact us. We have been exhibiting every year since 2008. This year's Powder Industry Exhibition will be held in Osaka. We look forward to seeing everyone there. Our sales engineers will be available at the venue to discuss various applications and case studies. 【Exhibition Information】 ■ Exhibition Name: "International Powder Industry Exhibition Osaka" ■ Venue: Intex Osaka ■ Dates: October 15-17, 2025 ■ Opening Hours: 10:00 AM - 5:00 PM (last day until 4:30 PM)
Line up（4）
| Model number | overview |
|---|---|
| DGS35kHz | Ultrasonic oscillator 35kHz frequency 50W/100W |
| C35-SD8 | Ultrasonic converter (transducer) |
| HF5ｍ | HF cable 5m |
| Clamp band jig | Clamp-type band fixture for various sizes of standard sieves. |
catalog（2）
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Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.
