We provide support for the development and prototyping of MEMS devices, such as microelectronic components developed through thick film plating!
Our company is engaged in the development of various MEMS devices, multi-sensor data loggers, and sensor network products. We are developing ultra-high sensitivity pressure sensors and implementing TSV processing such as tapered etching and scallop-free (minimal fab). Additionally, we are involved in the development of microelectronic components using thick-film plating. Please feel free to contact us if you have any requests. 【Business Activities】 ■ Development of ultra-high sensitivity pressure sensors ■ TSV processing: tapered etching, scallop-free (minimal fab) ■ Development of microelectronic components using thick-film plating, etc. *For more details, please download the PDF or feel free to contact us.
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Our company offers MEMS processing outsourcing, MEMS device development, and MEMS consulting services. Through MEMS technology, we create a prosperous future for people. Please feel free to contact us if you have any inquiries.
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