[Aerospace] Understand in 3 minutes! A substrate that dissipates heat faster.

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last updated：Jan 20, 2026

We present materials explaining the comparison of thermal conductivity between thermal vias and copper pins!

In the aerospace industry, it is essential to achieve both product reliability and weight reduction. This is particularly important for electronic devices used in harsh environments, where ensuring heat dissipation is crucial. Insufficient heat dissipation can lead to component failure or performance degradation. Our "faster heat-dissipating substrate" contributes to improving product reliability by enhancing heat dissipation. 【Application Scenarios】 - Electronic devices in aircraft and spacecraft - Electronic devices requiring weight reduction 【Benefits of Implementation】 - Improved heat dissipation - Enhanced product reliability - Contribution to weight reduction

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【Features】 - Structural comparison of thermal vias and copper pins - High thermal conductivity substrate - Comparison of thermal conductivity between thermal vias and copper pins - Effects of changing the filling material in thermal vias 【Our Strengths】 Our company was established in 1977 as a dedicated manufacturer of printed circuit boards. Under our unique management system, we achieve thorough delivery management, enabling us to respond to a variety of products with short lead times. We provide consistent services through a network with strengths in each sales location and region.