Flow Soldering Equipment "PLS series"

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last updated：Mar 22, 2017

センスビー

Official site

There are hardly any copper burrs, and the flow-up is excellent! The soldering device in the inner layer is also reliable.

The "PLS series" is a flow soldering device that performs flow dip soldering in a low oxygen concentration atmosphere. By controlling the posture of the workpiece in conjunction with the posture control of the chamber and conveyor, it is possible to create a stable atmosphere. Additionally, a chamber-type two-stage preheating and coordinated transport are employed for preheating. This allows for uniform heating of large multilayer workpieces while forming the desired preheating temperature profile. 【Features】 ■ The chamber moves to control the posture of the wiring board ■ Well-established low oxygen concentration ■ Excellent heat supply capability and uniform heating (flow dip) ■ CCR preheater ■ Coordinated transport *For more details, please refer to the catalog or feel free to contact us.

Related Link - http://www.sensbey.co.jp/

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【Other Features】 ■ Excellent heat supply capability achieves outstanding flow-up performance ■ Active chamber method realizes chamber sealing performance with an oxygen concentration of 100ppm ■ Active chamber method enables diverse liquid contact/release posture control for printed circuit boards ■ Multi-point PID control method for temperature control by dividing the preheating area ■ Expands the heating temperature control range for various parts of the printed circuit board by organizing the preheating process into two stages ■ Heat supply through a two-stage preheating process and a one-stage flow dip soldering process ■ Coordinates the transport of printed circuit boards at each stage to form a temperature profile ■ Soldering implementation of multilayer printed circuit boards with a 500mm opening with ease ■ Minimal stress on internal patterns, eliminating concerns about disconnection *For more details, please refer to the catalog or feel free to contact us.