Solve the long-awaited issue of insufficient through-hole ups! Effectively heat the necessary areas for soldering.
The "IPH (Induction Heating Preheat Function)" is based on proven heating nitrogen (N2) and point flow methods, and combined with induction heating (IH) preheating, it can efficiently heat and solder patterns and electrodes with large thermal capacities. With heated N2, through-hole ups that typically take time can be completed in a short period. It avoids insufficient heating, reduces solder temperature bath temperatures, and allows for transition to small-diameter nozzles. 【Features】 ■ Heats (generates heat) the patterns or electrode leads that need to be heated ■ IPH On/Off settings and On time can be configured for each step ■ Significantly reduces thermal stress on surrounding components *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Other Features】 - Evaluation conducted on basic components and circuit board patterns - Output switching is possible, allowing only necessary points (steps) to be turned ON (normally OFF) - The influence range of the magnetic field is displayed in the editing application *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."
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