Next-generation flow control solution
MFA (Mass Flow Amplifier) System The MFA system is a next-generation flow control solution that fundamentally resolves clogging issues in exhaust piping during semiconductor and display manufacturing processes. Unlike the conventional Hot N₂ (heated nitrogen) injection method, it combines the "Coanda effect" and "swirl flow technology" to create a stable layer of airflow inside the piping. This prevents by-products (powder) from adhering to the pipe walls and dramatically improves exhaust efficiency. 1. Dramatically extends maintenance cycles and maximizes productivity 2. Prevents powder accumulation with innovative "swirl design" 3. Excellent energy-saving performance and cost-effectiveness 4. Easy horizontal deployment to existing lines and high reliability ~Technical Features~ Coanda effect and swirl flow: The rotation of the injected gas forms a swirling airflow, creating a protective layer on the inner walls of the piping, thereby suppressing the adhesion of by-products. Uniform velocity distribution: Compared to the existing Hot N₂ method, it maintains uniform pressure and flow velocity within the piping, minimizing powder accumulation.
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basic information
The MFA system consists of a controller and modules (CFT series). 【Basic Specifications】 Product Name: Mass Flow Amplifier (MFA) Main Components: Controller (CS-1000 series), Modules (CFT-40 / CFT-50) Input Power: 210-230 VAC ±10% (50/60 Hz) Temperature Control: Hot N₂ (0-250℃, maximum 300℃), Pad Heater (0-200℃, maximum 230℃) N₂ Flow Rate: Standard maximum 100 LPM (expandable up to 500 LPM as an option) Communication/Interface: RS-485 (Modbus RTU), RJ45, D-Sub 9 Pin Safety and Protection Features: N₂ low pressure interlock (< 0.25 MPa), over-temperature prevention (bimetal, temperature fuse), low flow alarm External EMO (emergency stop) compatible Certification: NRTL certification (controller), UL 61010-1, compliant with SEMI S2 / S8 *For more details, please consult us.
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Applications/Examples of results
Customer / Process ■ Company S / Metal Etch Pre-introduction issues: Frequent nozzle clogs (PM cycle 7 days) Post-introduction effects: Operated for over a year without PM, applicable for mass production and horizontal deployment ■ Company S / Oxide Etch Pre-introduction issues: Pipe clogs (PM cycle 4 weeks) Post-introduction effects: Pipes usable for over 6 months ■ Company O / CVD, Etch Pre-introduction issues: Frequent replacement of silencers and traps (PM 1-2 weeks) Post-introduction effects: No need to replace silencers, no PM required at the scrubber inlet
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Company information
Our customers vary from global manufacturers to small domestic businesses. Due to these characteristics, we handle a variety of items and have the ability to communicate with customers. Cost, delivery, productivity, quality etc… We connect, communicate and help solve the challenges of customers through our wide network around the world.
![[★Demo unit available for loan] Airflow visualization set](https://image.mono.ipros.com/public/product/image/5e2/2000716136/IPROS26507171211429380701.jpeg?w=280&h=280)
