Overcoming the height difference between semiconductor chips! Innovative COC bonding with copper ball spacers.
We directly bonded memory chips and SOCs (COC) and responded to the advanced requirements of flip chip mounting onto package substrates. By coordinating the networks of four companies and ten processes, we successfully achieved bonding between heterogeneous chips of varying heights. Utilizing 40µm pitch copper pillar bonding and 90µm copper balls as spacers, we realized the shortest connections between chips and substrates. This structure, which maximizes signal transmission efficiency, provides a significant advantage in high-speed processing devices. *Details of the network that successfully integrates heterogeneous chips are illustrated in the accompanying materials.*
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The details of the network that successfully integrates heterogeneous chips are illustrated in detail in the materials.
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The details of the network that successfully integrates heterogeneous chips are illustrated in detail in the materials.
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Connectec Japan Co., Ltd. is a process development-oriented semiconductor backend contract OSRDA that creates new packages through its core technologies, bump-on-material and damage-free bonding, known as MONSTER PAC. If you are facing challenges with semiconductor chip assembly or MEMS chip manufacturing and assembly, please consult us first. Our experienced development team will respond to any of your requests.