From dicing to laser! For cutting processing of thin-film displays.
In the display industry, as the trend towards thinner products continues, there is a demand for precise cutting of transparent materials such as glass substrates. The conventional blade method tends to cause fine cracks and chipping, which can lead to reduced yield and unstable quality. The stealth dicing laser processing machine, equipped with Hamamatsu Photonics' patented Stealth Dicing Engine, addresses these challenges. 【Application Scenarios】 - Manufacturing of thin displays - Precision processing of transparent materials - Yield improvement 【Benefits of Implementation】 - Improved yield through high-precision dicing - Increased productivity through high-speed processing - Compatibility with a wide range of materials
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【Features】 - High-precision dicing of transparent materials - Process efficiency and productivity improvement - Wide range of material compatibility - Support for fine processing 【Our Strengths】 Nishishin Shoji Co., Ltd. leverages years of experience and know-how to provide optimal solutions tailored to customer needs. We combine trading company functions with manufacturing capabilities, offering consistent services from product selection to implementation and after-sales support.
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Since its establishment on March 10, 1952, Seishin Shoji Co., Ltd. has introduced a variety of products to the domestic market. As a trading company, it has particularly contributed to the field of analysis, starting with the import of analytical standard materials. Additionally, while it has been active as a technical trading company in the electronic components industry, in recent years it has expanded not only as a trading company but also into the design and manufacturing of new electronic devices, making significant strides in the manufacturing sector and achieving a wide range of activities both domestically and internationally.
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