Case study of DED-type additive manufacturing using hard TiC-Ni based powder for 3D printers.
New proposal for an alternative to hard chrome plating and wear-resistant coatings! Achieving a high hardness coating through DED method fabrication!
We have proposed tungsten carbide powder (WC-Co type) as a powder for 3D printers, utilizing our long-standing expertise in granulation and sintering technology. While tungsten carbide is expected to offer excellent hardness and wear resistance, there have been challenges in its application to DED methods, such as the tendency for cracks to occur during the shaping process. To address this issue, we have released a hard ceramic metal powder (TiC-Ni powder) suitable for DED additive manufacturing. **Features:** - Hardness of 1060 HV and proven results with no cracks or pores in the shaped body* - High-flow powder that contributes to high density - Particle size tailored for DED equipment **Expected Applications:** - Repair of large structures and components, hard coatings, and alternatives to hard chrome plating If you have any inquiries or challenges regarding 3D printing with tungsten carbide powder, please feel free to contact us. *Measurement method: Hardness measured according to ISO 14577-1 and converted to Vickers hardness using a correction factor. This is a representative value measured near the surface of a 1 Line × 3 Layer shaped object with a length of 20 mm and is not a guaranteed value.
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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.
