Results from 2000 hours of various aging tests demonstrate reliability at an operating temperature of 150°C!
The "HT-21" is a high-performance thermal conductive phase change sheet with a thermal conductivity of 7.5 W/m·K. It softens between 50°C and 70°C, reducing the initial pad thickness to about 35 μm, resulting in a thin bond line. The special polymer matrix provides excellent pump-out resistance compared to thermal conductive grease and other phase change materials. 【Features】 ■ Used between the CPU or chip and the heat sink ■ Enhances heat dissipation performance by softening with heat and improving adhesion ■ High thermal conductivity of 7.5 W/m·K ■ Excellent low thermal resistance due to superior wettability of the contact surface and air replacement ■ Moderate tackiness due to no silicone formulation *For more details, please refer to the related links or feel free to contact us.
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【Specifications (Partial)】 ■Manufactured by Laird Technologies, Inc. Tpcm 7125 ■Thermal conductivity: 7.5 W/m·K ■Thermal resistance: 0.10℃·cm²/W (at 10 psi/70℃), 0.06℃·cm²/W (at 50 psi/70℃) ■Operating temperature: -40 to 125℃ ■Softening temperature: 50 to 70℃ *For more details, please refer to the related links or feel free to contact us.
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Our company handles front and rear I/O, drive accessories, internal power cables, and cooling fans. Please feel free to contact us if you have any requests.
