X-ray inspection equipment [TRI Corporation] detects defects in TGV and Cu pillars with high precision.
TR7600F3D SII Plus
High adoption record in the electronic implementation and semiconductor AXI market.
Defect detection in semiconductor manufacturing processes, including TGV and Cu pillars, is essential for improving yield, yet existing optical inspections have limitations. TRI's X-ray equipment has a rich track record in the semiconductor AXI market and meets the high-performance and fine inspection needs with a maximum resolution of 2µm and up to 1000 CT slices. ■ Main Inspection Targets - AI Cu pillar inspection - TGV 3D AXI inspection - C4 bump inspection - SiP 3D AXI support ■ Main Benefits - Maximum resolution: 2µm - X-ray output: up to 110kV - Supports large substrate inspections - Dose limits and estimates can be managed via software - Initial adjustments and fine-tuning by AI We also welcome inquiries about models other than the TR7600F3D SII Plus introduced here. Please feel free to contact us.
Inquire About This Product
basic information
For more details, please refer to the materials or contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the materials or contact us.
Company information
We manufacture and sell dispenser devices that achieve high-speed and high-precision micro-dispensing on a wide range of materials and substrates. With sales networks in 19 locations in Japan and 12 overseas, we propose dispensing solutions to be a closer presence for our customers.
