Visualize the pressure distribution at the joints in high resolution to streamline quality control.
In the semiconductor industry, accurate evaluation of pressure distribution at the joints is essential to ensure product reliability. Particularly in the wafer and chip bonding processes, the uniformity of pressure affects the performance and lifespan of the products. Improper pressure distribution can lead to bonding defects and early product failures. The Presscale Station addresses these challenges by visualizing the pressure distribution at the joints. 【Usage Scenarios】 - Pressure evaluation in wafer bonding processes - Confirmation of pressure distribution in chip mounting processes - Investigation of the causes of bonding defects 【Benefits of Implementation】 - Improvement in bonding quality - Reduction in defect rates - Enhancement of product reliability
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【Features】 - High precision and high resolution - Smooth operability - Acquisition of detailed pressure data with a resolution of 0.27mm square - Automatic pass/fail judgment function 【Our Strengths】 We provide pressure measurement film "Prescale" and its analysis device "Prescale Station." We offer optimal solutions tailored to our customers' needs, supporting everything from product development to quality control.
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Our Measurement Film Solutions Division offers a variety of products, including high-temperature press scales and UV scales. We have the film "Press Scale," which allows for easy confirmation of invisible pressure and pressure distribution, and the revolutionary thermal distribution visualization film "Thermo Scale," which enables simple judgment of thermal distribution through color changes. Additionally, we provide a wide range of excellent inspection and measurement products that enhance precision, efficiency, and stability in manufacturing, inspection, and testing processes, all developed from the production processes of Fujifilm products.
