Heater table
The bonding process involves high temperatures, so it is manufactured to withstand that environment. It is a porous chuck mainly used in the bonding process of semiconductor manufacturing. It is also referred to as a heat block.
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basic information
- 250° heat-resistant use - Suitable for adhesion of various packages (QFN, BGA, CPS, WLCSP)
Price information
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Delivery Time
Applications/Examples of results
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Company information
We will shape "what you want" through conversations with our customers. Even if you cannot create a drawing, our staff will create the drawings while listening to your ideas. Our company has a comprehensive system in place from design to manufacturing and delivery.
![[Information] Chuck Removal Procedure for Yoshimura Iron Works Products](https://image.mono.ipros.com/public/product/image/07c/2000432809/IPROS10628517074026875427.jpg?w=280&h=280)
![[Free Adhesion Test in Progress] Robot Transport Using Electrostatic Chuck](https://image.mono.ipros.com/public/product/image/f54/2000597250/IPROS45410531793134543182.jpeg?w=280&h=280)
