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  1. Home
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  3. 吉岡精工
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吉岡精工

Establishment1971 year
capital3000Ten thousand
addressKanagawa/Tsurumi-ku, Yokohama-shi/1-1-49 Suehirocho (Suehiro Factory Park)
phone045-500-1363
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last updated:Sep 04, 2025
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  • Products/Services(13)
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吉岡精工 Product Lineup

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1~13 item / All 13 items

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Chuck "Polars Chuck"

We achieve reliable and stable workpiece adhesion and fixation in various industrial machinery and equipment.

The "Porous Chuck" is a component primarily incorporated into dicing saws, bonders, and inspection equipment in the semiconductor manufacturing process. By utilizing the porous structure of the table surface and negative pressure, it is possible to hold thin silicon wafers flat. We manufacture it as a "one-of-a-kind" product, customizing the appropriate materials and shapes according to the specifications and requests of each customer. Additionally, we offer a variety of unit products with added functions, such as "HoVaC" and "Surface Emitting Porous Chuck." 【Features】 ■ Stable adhesion ■ Diverse porous materials ■ High precision and quality ■ Flatness of 3μm or less ■ MADE IN JAPAN *For more details, please refer to the PDF document or feel free to contact us.

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Chuck "Semi-Order Porous Chuck"

~Easily choose specifications on the web~ Semi-order porous chuck

Porous chuck that selects the optimal combination from pre-prepared specifications No need for "meetings," "estimates," or "account openings" Sales of porous chucks available for immediate purchase online have begun.

  • Semiconductor inspection/test equipment

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Chuck "Immediate Delivery Porous Chuck"

~Easily accessible high-precision porous chucks~ Ready-to-ship porous chucks

A porous chuck that can be easily purchased by producing stock only for specific specifications Fastest shipping the next day (depending on stock availability) Introduction at a trial price Speedy purchase with online payment services

  • Grinding Machine
  • Chuck
  • Processing Jig

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Part "Blade Holder"

Flange for dicing saw "Blade Holder"

This is a component used in the dicing saw of semiconductor manufacturing processes, which holds a thin blade for cutting silicon wafers. It is commonly referred to as a titanium flange or hub mount. The spindle of the dicing saw is designed for high-speed rotation, so the blade holder is made from lightweight and high-rigidity titanium alloy.

  • Wafer processing/polishing equipment
  • Diamond cutter
  • cutter

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Chuck "Hot Vacuum Chuck (HoVaC)"

Heating and cooling experiments can be conducted while suctioning! A vacuum chuck that achieves low cost.

The "Hot Vacuum Chuck (HoVaC)" integrates functionality while achieving low cost. It allows for consistent and stable heating and cooling across the entire porous working surface, enabling strong adhesion of the workpiece. It can be used for electrical durability tests of wafers while heated. 【Features】 ○ Ideal for durability tests with repeated heating and cooling ○ Simple structure that only requires screwing in the porous chuck ○ Compatible with round types of 6, 8, and 12, and square types of 150, 200, and 250 For more details, please contact us or download the catalog.

  • Chuck

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Chuck "Square Type Surface Emitting Porous Chuck"

The suction surface glows like a backlight.

This is a porous chuck that adds a light-emitting function by incorporating a light source. It features a function that allows the adsorption surface to emit light like a backlight, enabling "adsorption fixation + light emission."

  • Lighting for image processing

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Chuck "Surface-emitting Porous Chuck"

The outline of the work emerges clearly! It greatly contributes to improving the workability of the inspection process.

The "surface-emitting porous chuck" is a product that has the function of being illuminated from the back with a backlight while in an adsorbed state. Instead of using a backlight, it emits light from the chuck area, significantly contributing to the improvement of work efficiency in the inspection process. Additionally, it can be expected to assist in the signal function evaluation of optical elements and alignment support. 【Features】 ■ Adds backlight functionality for fixing the workpiece ■ Size can be adjusted according to application ■ Emits light over the entire surface rather than point light ■ No variation in brightness ■ Dimmable up to 100,000 lux *For more details, please refer to the PDF document or feel free to contact us.

  • Other inspection equipment and devices
  • Image Processing Equipment
  • Inspection fixture

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Chuck "Fine Porous Chuck"

No restrictions on the size or shape of the workpiece! A chuck that can partially grip.

The "Fine Porous Chuck" can partially adsorb regardless of the size and shape of the workpiece. It is ideal for semiconductor manufacturing equipment and various semiconductor inspections. We can accommodate other specifications such as shape, dimensions, and body material upon consultation. 【Features】 ○ Uses a dense porous material compared to conventional products ○ Air leakage is less likely to occur, so the holding power does not decrease even with partial adsorption ○ Made of alumina ceramic porous material, allowing for high-precision processing as before For more details, please contact us or download the catalog.

  • Chuck

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Chuck "Standard Specification Porous Chuck"

Standard Specification Porous Chuck

Standard specification porous chuck. It offers excellent cost performance and can accommodate short delivery times.

  • Inspection fixture
  • Processing Jig
  • Chuck

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Chuck "12-Inch Porous Chuck"

12-inch porous chuck

A porous chuck used in fully automatic semiconductor structure devices (mainly dicing saws). This is a porous chuck used in fully automatic semiconductor manufacturing equipment (mainly dicing saws). It is used in types of dicing saws that perform the entire process from "wafer extraction → alignment → cutting → cleaning/drying → wafer storage" automatically. To rotate the wafer along with the porous chuck during the cleaning and drying processes, there are no unnecessary protrusions on the outer circumference of the porous chuck.

  • Inspection fixture
  • Processing Jig
  • Chuck

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Chuck "Metal Porous Chuck"

Metal porous chuck

This is a porous chuck made of durable metal porous material with a porous structure. By selecting a porous SUS material, electrical conductivity can be established between the workpiece and the porous structure.

  • Inspection fixture
  • Processing Jig
  • Chuck

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Chuck "Carbon Porous Chuck"

Conductive new material glassy carbon! Almost no dust generation chuck.

The "Carbon Porous Chuck" is a chuck that is less prone to static electricity due to its conductivity. It is composed of a special material made of 100% glass-like carbon, resulting in minimal dust generation and a smooth adsorption surface. It excels in corrosion resistance and heat resistance, making it difficult to scratch the workpiece being held. 【Features】 ○ Conductive (specific resistance 2.4×10^-2 [Ω·m]) ○ Excellent corrosion resistance and heat resistance against corrosive gases and liquids ○ Since it uses glass-like carbon, there is no color transfer like that of graphite For more details, please contact us or download the catalog.

  • Chuck

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Chuck "Heater Table"

Heater table

The bonding process involves high temperatures, so it is manufactured to withstand that environment. It is a porous chuck mainly used in the bonding process of semiconductor manufacturing. It is also referred to as a heat block.

  • Inspection fixture
  • Processing Jig

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