Heater table
The bonding process involves high temperatures, so it is manufactured to withstand that environment. It is a porous chuck mainly used in the bonding process of semiconductor manufacturing. It is also referred to as a heat block.
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basic information
- 250° heat-resistant use - Suitable for adhesion of various packages (QFN, BGA, CPS, WLCSP)
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We will shape "what you want" through conversations with our customers. Even if you cannot create a drawing, our staff will create the drawings while listening to your ideas. Our company has a comprehensive system in place from design to manufacturing and delivery.
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