12-inch porous chuck
A porous chuck used in fully automatic semiconductor structure devices (mainly dicing saws). This is a porous chuck used in fully automatic semiconductor manufacturing equipment (mainly dicing saws). It is used in types of dicing saws that perform the entire process from "wafer extraction → alignment → cutting → cleaning/drying → wafer storage" automatically. To rotate the wafer along with the porous chuck during the cleaning and drying processes, there are no unnecessary protrusions on the outer circumference of the porous chuck.
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basic information
This is a large-diameter porous chuck compatible with 300mm wafers. We have also completed prototypes of even larger diameters and are working on compatibility with next-generation large-diameter wafers.
Price information
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Delivery Time
Applications/Examples of results
【Examples of Use】 ■ Semiconductor manufacturing equipment ■ Various semiconductor inspection and measurement equipment ■ FPD manufacturing equipment, transport equipment ■ Image analysis equipment, various drawing devices, optical microscopes ■ Lithium-ion batteries ■ Medical devices ■ Printing transport and coating, etc. *For more details, please refer to the PDF document or feel free to contact us.
Company information
We will shape "what you want" through conversations with our customers. Even if you cannot create a drawing, our staff will create the drawings while listening to your ideas. Our company has a comprehensive system in place from design to manufacturing and delivery.
