We also support systems and equipment that include plasma technology.
Small equipment using plasma technology We also accommodate systems and equipment that include plasma technology. 【Example Specifications (Equipment Configuration)】 ◇ Touch panel control Film winding speed adjustment Tension control Plasma power adjustment Gas flow rate adjustment, etc. ◇ Continuous processing of film using R to R Primary processing with atmospheric pressure plasma Adjustable plasma irradiation position ◇ Secondary processing with a spray coater Adjustable coating amount Adjustable spray position ◇ Tertiary processing with heater heating Adjustable heating temperature Adjustable distance between heater and film Please feel free to consult us regarding specifications. Additionally, if you require experiments conducted by our technical staff, we can accommodate this for an optional fee. For any other questions, please do not hesitate to contact us.
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Small equipment using plasma technology We also support systems and equipment that include plasma technology. 【Example Specifications (Equipment Configuration)】 ◇ Touch panel control Film winding speed adjustment Tension control Plasma power adjustment Gas flow rate adjustment, etc. ◇ Continuous processing of film using R to R Primary processing with atmospheric pressure plasma Adjustable plasma irradiation position ◇ Secondary processing with a spray coater Adjustable coating amount Adjustable spray position ◇ Tertiary processing with heater heating Adjustable heating temperature Adjustable distance between heater and film Please feel free to consult us regarding specifications. Additionally, if you require experiments conducted by our technical staff, we can accommodate this for an optional fee. For any other inquiries, please do not hesitate to contact us.
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Applications/Examples of results
◇Continuous processing of film using R to R ◇Secondary processing using a spray coater ◇Tertiary processing using heater heating ◇One-axis and two-axis robotic mechanisms ◇Reel winding mechanism, etc.
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Company information
KAI Semiconductor was established in September 2002 as a venture company originating from Kyoto Institute of Technology. It sells surface modification devices and deposition equipment using plasma technology. The powder plasma device released in 2010 was recognized for its high technical capabilities and received the "Kansai Front Runner Award" and the "Small and Medium Enterprises Technology Award." There are numerous implementation records at universities nationwide, AIST, major manufacturers, and R&D departments. We propose sales after you have had the opportunity to touch the actual product (demo unit). Additionally, we offer rental and leasing options to reduce the burden on our customers. We also accept various technical consultations beyond semiconductor-related matters. Furthermore, we process and sell quartz and Pyrex in small lots.