Since there is no need for wire bonding in the inspection of individual LED chips, work efficiency has significantly improved.
【Features】 - Easy attachment and detachment of LED chips (before packaging) - Compatible with flip chip technology - After aging, chips can be directly mounted on the integrating sphere for measurement without removal - Easy attachment and detachment to the aging substrate - Heat-resistant materials are used considering the heat generation of LED chips, with heat dissipation measures in place *For more details, please feel free to contact us.
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basic information
Our company’s basic policy is "Sales = Solving Customer Problems." Through our excellent socket design capabilities, we provide "quick and reliable" solutions to the testing issues faced by our customers. 《If you have any concerns related to "sockets," please feel free to consult with us》 - I want to improve the process. - I want to resolve the issues I am currently facing quickly. - I want to create something that fits a special device. - I would like to request additional items related to the socket. Our strengths: ■ Idea and product application capabilities ■ Quality and cost responsiveness ■ Speedy production response ■ Problem-solving speed
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Company information
In this rapidly changing era, we aim to be a company that prioritizes customer satisfaction and strives to be No. 1 in customer satisfaction by being: - A flexible company - A customer-centric company - A company that is needed by our customers. *Please note that the published information has been updated as of April 21, 2025. If you are specifically interested, feel free to contact us through the inquiry section on our website.
