High-functionality small hole printed circuit board (blind vias, via posts, through holes, etc.) preprocessing and plating equipment systematized with ultrasonically vibrating flow technology.
The "Super Control System," a high-speed and high-quality plating device for small hole printed circuit boards, combines an ultra-vibration α-stirrer, a vibration system, a cathode rocker (oscillation), and aeration using a porous ceramic aeration pipe, enabling high-speed and high-quality plating specifically for small hole printed circuit boards.
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【Features】 ○ High-speed plating with more than double the throwing power is possible for multilayer printed circuit boards with small hole diameters (around 100 microns). ○ Good plating can be achieved for small holes in printed circuit boards with BVH (30 microns to 50 microns). ○ There are no gas pit defects inside the holes of the printed circuit boards. ○ Ideal for plating printed circuit boards with high aspect ratios and small holes. ○ Uniform electrodeposition (standard deviation of about 1.0) is superior to any other method. ○ Superior in glossiness. ○ Regardless of the type of surface treatment solution, excellent products can be obtained in a short time compared to conventional methods. ● For more details, please contact us or download the catalog.
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