The substrate is adsorbed and transported without changing the setup, depending on the size of the substrate and the position of the holes.
There is no need to change the setup of the suction device based on the size of the substrate or the position of the holes. The substrate is held in a non-contact state by a negative pressure generation function that blows air, allowing for transport. Therefore, it does not leave scratches or dirt on the substrate.
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basic information
The "printed circuit board suction device" adsorbs and transports printed circuit boards, through-hole boards, FPCs, and ceramic substrates regardless of the position of the holes. There is no need to change the setup of the suction device based on the size of the substrate or the position of the holes. The "printed circuit board suction device" holds the substrate in a suspended state without contact by generating negative pressure through the ejection of air, allowing for transportation. Therefore, it does not cause scratches or dirt to adhere to the substrate.
Price information
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Delivery Time
P3
Applications/Examples of results
Substrate feeding, loader and unloader for inspection equipment, substrate transport. There is no need to change the setup of the suction device based on the size of the substrate or the position of the holes. The substrate is held in a suspended state without contact and transported using a negative pressure generation function that blows air. Therefore, it does not leave scratches or dirt on the substrate.
Company information
Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.
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