Copper-clad laminate for flexible printed circuits
■ Excellent heat resistance for soldering, capable of withstanding the flow soldering process, and used in a wide range of electronic components. ■ Excellent thermal dimensional stability, allowing for the formation of high-density patterns. ■ Excellent flexibility. ■ Excellent flame retardancy.
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■Excellent heat resistance for soldering, capable of withstanding the flow soldering process, and used in a wide range of electronic components. ■Excellent thermal dimensional stability, enabling the formation of high-density patterns. ■Excellent flexibility. ■Excellent flame retardancy.
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I want to develop technologies that shine brightly, even if they are small. Since its founding, Nikkankogyo has cultivated core technologies in "coating," "laminating," and "stacking." Our fundamental stance is to respond to the technologies that our customers seek. We always focus on our customers' future needs and create products with new ideas and unique technological development capabilities. This USER-ORIENTED spirit permeates all of our business processes. As product needs change rapidly and development cycles shorten year by year, we possess the insight to anticipate the future and dedicate ourselves to the technological development that brings those ideas to life.