Film for polyimide film substrate coverlay.
■It has excellent heat resistance to soldering and can sufficiently withstand the flow soldering process, making it suitable for a wide range of electronic components. ■It has excellent electrical properties. ■It has excellent flexibility. ■There is little resin flow during pressing.
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■It has excellent heat resistance to solder and can sufficiently withstand the flow soldering process, making it suitable for a wide range of electronic components. ■It has excellent electrical properties. ■It has excellent flexibility. ■There is minimal resin flow during pressing.
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I want to develop technologies that shine brightly, even if they are small. Since its founding, Nikkankogyo has cultivated core technologies in "coating," "laminating," and "stacking." Our fundamental stance is to respond to the technologies that our customers seek. We always focus on our customers' future needs and create products with new ideas and unique technological development capabilities. This USER-ORIENTED spirit permeates all of our business processes. As product needs change rapidly and development cycles shorten year by year, we possess the insight to anticipate the future and dedicate ourselves to the technological development that brings those ideas to life.