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Printed circuit board manufacturing

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last updated:Jan 22, 2002

サンヨー工業 東京営業所
サンヨー工業 東京営業所
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We accept inquiries regarding printed circuit boards.

By implementing a thorough production management system and well-equipped manufacturing facilities, we achieve in-house integrated production that responds to ultra-short delivery times. We can handle 6-layer boards in just 2 days!

    Printed Circuit Board
002623001.image_data.jpg

Printed circuit board manufacturing

002623001.image_data.jpg
002623001.image_data.jpg
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basic information

1. High multilayer - Manufacturing of multilayer boards from 3-layer to 36-layer. Build-up. IVH. BVH compatible. 2. High density - Line and space = 50μ/50μ, high aspect ratio, board thickness 5.0t, hole diameter 0.35Φ, finished board thickness, 0.1t to 6.5t, other through holes on pads, multilayer copper foil thickness 12μ to 105μ. 3. Responding to diversified needs Compatible with special materials (polyimide, Teflon, Gore-Tex, and others) Supporting next-generation substrates (CSP, BGA, and others)

Price information

-

Delivery Time

P4

Applications/Examples of results

●For those troubled by substrate delivery times ●Technical inquiries regarding printed circuit boards ●Consultations regarding quality (high density, high multilayer, etc.) ●Consultations regarding impedance control

Company information

サンヨー工業

サンヨー工業 東京営業所

Industrial Electrical Equipment

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■We have a large stock of special materials used for high-frequency substrates, enabling short lead-time manufacturing. ■We also handle various low-alpha materials, represented by high-performance FR-4. Those struggling with lead-free solder mounting can resolve their issues with low-alpha materials. ■ISO 14001:2004 certification.

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