Ideal for prototype development of laser diodes and fine chip implementation.
Installation of two cameras, top and bottom. Alignment based on chip alignment marks, bumps, pads, and outlines. High-precision bonding is performed. A general-purpose simple flip chip bonder that is not restricted by device types, materials, or bonding methods.
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【Features】 ○Alignment accuracy: ±5 microns ○Bonding load: 5-1000g ○Chip size: 0.2-30mm ○Board size: 50X50mm ○Heater temperature: 400℃ ●For more details, please contact us.
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![[Use Case] High-Precision Die Bonder for Optical Component Packaging and Module Assembly](https://image.mono.ipros.com/public/product/image/5e6/2000270614/IPROS22137770162123637982.png?w=280&h=280)
