Ultra-high precision flip chip die bonder
Ultra-high precision die flip chip bonder 1250, automatic die flip chip bonder 1300, manual flip chip bonder 6000.
Ultra-high precision alignment within ±1um. Ideal for prototype development.
Prototype/development specialized die flip chip bonder. It combines high-precision die bonding and flip chip bonding functions, allowing for ultra-high precision bonding through manual adjustments on the monitor screen. (For model MOA1250, no-load alignment ±1 micron) High-precision bonding is easily achieved through PC or sequencer control. ● It is compatible with various objects such as silicon wafers, chips, ceramic substrates, and FR4. ● Feedback on the movement amount is provided for each actuator unit, enabling ultra-high precision. (MOA-1250 type) ● Bonding can be performed in low oxygen concentration using an air curtain heat-up stage. ● Various options available, including conical collets, pulse heaters, and scribing functions. ● All equipment is made to order, customizable in layout, budget, and functions.
Inquire About This Product
basic information
A die flip chip bonder specialized for prototyping and development. It combines high-precision die bonding and flip chip bonding functions, allowing for ultra-high-precision bonding through manual adjustments on the monitor screen. (For model MOA1250, the alignment without load is ±1 micron.) High-precision bonding is easily achieved through PC or sequencer control. ● It is compatible with various objects such as silicon wafers, chips, ceramic substrates, and FR4. ● Feedback on the movement amount is provided at the actuator unit, enabling ultra-high precision. (MOA-1250 type) ● Bonding can be performed in low oxygen concentration using an air curtain heat-up stage. ● Various options are available, including conical collets, pulse heaters, and scribe functions. ● All equipment is made to order, allowing for customization of layout, budget, functions, etc.
Price information
8 million yen or more (please contact us for detailed pricing)
Price range
P6
Delivery Time
※It varies depending on the production period, approximately 3 months. Please contact us.
Applications/Examples of results
It is a practical and standard bonder that is actually used in the research laboratories of 20 major domestic electrical manufacturers.
Company information
We will listen to your requests and provide the optimal solution.
![[SH High-Temperature Substrate Heater] For PVD, CVD Max 1100℃](https://image.mono.ipros.com/public/product/image/f14/408104013/IPROS72020025232961980617.jpeg?w=280&h=280)
![[Semiconductor/Class 100 Compatible] 100% Water-Free Air Nozzle](https://image.mono.ipros.com/public/product/image/2116982/IPROS15202438644694791694.png?w=280&h=280)
