Multi-Wafer Handling Die Bonder (Auto)
The company's equipment is a die bonder that achieves high precision and high throughput for mass production.
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basic information
Alignment accuracy: ± 3 µm @ 3 σ Throughput: 3 seconds/Chip Load (bond force): 10 – 250 g Implemented applications: various optical transceivers & sensor packages (TOSA, ROSA, Mechanical Optical Interface (MOI), 3D sensor, inertial sensor, etc.) Bonding method: epoxy resin Others: multi-wafer handling compatible Options: flip chip compatible, waffle pack and gel pack supply compatible
Price information
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Applications/Examples of results
various optical transceivers & sensor packages (TOSA, ROSA, Mechanical Optical Interface (MOI), 3D sensor, inertial
Company information
Our company started in 1982 as a technical trading company specializing in the sales and maintenance services of semiconductor manufacturing equipment imported from overseas, as a group company of Kanematsu Corporation. Recently, in order to meet the diverse needs of our customers, we have been committed to ensuring that not only manufacturing equipment but also overseas products such as parts, materials, and subsystems can be used with confidence by our customers. While being a trading company, we have enhanced our technical department, which is responsible for planning, development, design, and manufacturing, to propose comprehensive technical solutions and expand our business globally to customers both domestically and internationally. In the future, we aim to continue being a company that provides new added value and services as an electronics technology trading company, growing together with our customers.
