High-precision bonding machine with ±5μm accuracy
The chips are pushed up from the wafer (tray) and adhered, followed by alignment through image processing after flipping them upside down. Automatic flip chip bonding is performed using thermal compression/adhesive (dispensing)/eutectic methods. The alignment accuracy is ±5 microns (under no load).
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basic information
【Features】 ○ Easy exchange of wafers/assembly boards, suitable for small-lot, diverse production. ○ Assembly wafers 4-8 inches (broken wafers acceptable). ○ Control via PC software. ○ Various options such as conical collets, pulse heaters, scribers, stamping, and more. ○ Customizable layouts, budgets, and functions through made-to-order production. ● For more details, please contact us.
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