Complex machining of special metals is done with ease! Burrs are finished to a level of a few micrometers or less.
Teknisco specializes in fine chip processing at the level of 200μm□ to several millimeters□. We can achieve sharp edges and finish burrs to a level of less than a few micrometers, as well as perform complex cutting processes on special metals known as difficult-to-cut materials, such as CuW, Kv, Ag, Mo, and Cu. Additionally, we can accommodate Ni/Au plating, AuSn deposition, partial plating, and pattern metallization. 【Features】 - Realization of ceramic coating treatment on metal materials - Solder bonding of various components - Support for AuSn and AuGe deposition on various heat sinks (ceramic, metal parts, assembled parts) - Burrs < 5μm *For more details, please refer to the PDF document or feel free to contact us.
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【Product Examples】 ■ Microchannel Cooler ■ CuW Submount ■ Insulated Cu-AlN-Cu Submount ■ High Voltage Seamless Microchannel ■ Mount/Carrier *For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■ LD carrier for optical communication ■ PD carrier for optical communication *For more details, please refer to the PDF document or feel free to contact us.
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We will propose the most suitable solutions that match our customers' requirements, considering quality, cost, and mass production, through our advanced composite processing technology (Cross Edge Micro Machining), which combines five cutting-edge techniques: cutting, grinding, polishing, metalizing, and joining.